PhD defence of Yousef Safari – Design Methodologies for Heterogeneous Integration Platforms

Abstract

Emerging heterogeneous chiplet-based platforms, such as interposers, three-dimensional integrated circuits (3D ICs), and Si-IF, where integrated numerous small chips on an interconnect fabric to build scalable computing platforms, have been made possible by recent breakthroughs in integration technology. Chiplet-based systems outperform systems-on-chip in terms of power efficiency, density, communication speed, and yield, particularly for demanding workloads such as deep learning. To address the specific needs of emerging chiplet-based platforms, such as modularity, scalability, timing, power, and area constraints, new design strategies, comprising essential circuit-level services such as power management and delivery and system-level services such as hardware security modules must be carefully designed. This research presents novel design methodologies for key design aspects of the emerging 3D and chiplet-based platforms, including power delivery, thermal management, and hardware security. In other words, the proposed research plan targets security-, power-, and thermal-aware tools and methodologies that support chiplet-based platforms.