Booking XPS, XRD, MicroCT

Booking other characterization equipment

  • SEM 
  • Ellipsometer
  • Optical Profiler 
  • Optical Microscope
  • Reflectometer
  • Profilometer 
  • Stress Measurement 

Characterization Equipment


Make & Model: Bruker High Resolution Micro-Computed Tomography (microCT): Skysan1172

MicroCT scan

MicroCT samples


  • X-ray source: 20-100kV,10W, <5 µm spot size
  • Detail detectability: 0.5 µm at highest resolution
  • X-ray detector: 11Mp, 12-bit cooled CCD fiber-optically coupled to scintillator
  • Maximum object size: 27mm in diameter (single scan) or 50mm in diameter (offset scan)
  • Continuous scanning for long objects with 70mm maximum in length


  • Used for life science research, clinical research, material research (metals, polymers & plastics, ceramics, composites, etc.)
  • Allow to cut virtual sections or even fly through samples non-destructively
  • 2D/3D image analysis and realistic visualization of an object's internal microstructure - microtomography or micro-CT
  • No special preparation, coating or vacuum treatment is needed for samples



Make & Model: Bruker X-ray Diffraction (XRD) Analysis: D8 DISCOVER



  • High-performance Cu X-ray sources
  • X-ray Optics: monochromatic
  • Goniometer and Sample Stage: XYZ, 1/4-Cradle
  • Sample Alignment and Monitor: Optical/video microscope, laser/video
  • 2D Detector: VANTEC-2000, the largest 2Theta and Gamma coverage


  • Enables detailed analysis of any crystalline materials from fundamental research
  • Phase identification (Qualitative / Quantitative Analysis)
  • Crystal structure determination / Crystalline percentage
  • Grazing Incident X-Ray Diffraction (GIXRD)
  • Various solid materials in the forms of powder, bulk and film samples



Make & Model: X-ray Photoelectron Spectroscopy (XPS): Thermo-Scientific K-Alpha

XPS fig1


  • X-ray source: Al Kα micro-focused monochromator; Spot size (30-400 μm)
  • Analyzer: 180° double focusing hemispherical analyzer; 128-channel detector
  • Charge Compensation: Dual beam source; Ultra-low energy electron beam
  • Ion Gun: Energy range 200eV – 3keV
  • Sample Handling: 60×60mm sample area; 20mm maximum sample thickness
  • Vacuum System: 2 turbomolecular pumps for entry and analysis chambers
  • Data System: Avantage data system


  • Surface characterization for a variety of solid materials: metals, oxides, plastics, polymers, semiconductor and microelectronics, nano-engineering, and bio-materials
  • No special preparation required for various forms: powders, fibers, coatings, films, bulk materials
  • Element identification with the detection limit of 0.05%
  • Chemical state (bond) analysis with high resolution scanning
  • Depth profile analysis with Ar Ion gun sputtering
  • Tilt module for Angle reserved XPS (ARXPS)


Make & Model: Tescan VEGA 3 XMH

SEM in clean room


  • High vacuum chamber
  • Accelerating voltage: 200V – 30KV
  • Best resolution: 2nm at 30kV


  • This SEM is for imaging and characterization of the samples


Make & Model: Spora GES-5E



  • All measurements are made automatically as a function of: wavelength, angle of incidence, polarization state and time.
  • Standard spectral range is 230-900 nm


  • GES5E Optical Platform allows various measurement modes from Standard Ellipsometry to generalized Ellipsometry going thru photometric measurements (in Transmission and Reflection), Scatterometry, luminescence measurements.

Optical Profiler

Make & Model: Wyto NT8000

optical profiler


  • Optical profiler, with 8mm scan length
  • 5x and 50x objectives
  • 8" programmable stage
  • LED illumination system

Optical Microscope

Make & Model: Olympus MX51

optical microscope image in cleanroom

Specification and Application:

  • Sample inspection, 5x, 10x, 20x, 50x


Make & Model: Filmetrix F10-RT

image reflectometer


  • Thickness range:15nm-70um
  • Wavelength range: 380-1050nm


Make & Model: Ambios XP200



  • Height range upto 800um
  • Scan length upto 55mm support 200mm wafer with vacuum.


  • A stylus scans the sample surface at a programmable speed, while its position is sampled at small and regular intervals.
  • The data is logged and then processed by the application software to extract useful information such as step height, surface roughness and waviness.

Stress Measurement

Make & Model: Flexus 5200

Stress measurement

Specifications and Applications:

  • The Flexus 5200 Film stress meter system calculates film stresses.
  • It optically measures a wafer curvature radius with and without the deposited film; knowing the wafer thickness, the film thickness and the wafer modulus, Stoney's equation yields the film stress.
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