MECH 553 Design and Manufacture of Microdevices (3 credits)

Offered by: Mechanical Engineering (Faculty of Engineering)


Mechanical Engineering : Introduction to microelectromechanical systems (MEMS). Micromachining techniques (thin-film deposition; lithography; etching; bonding). Microscale mechanical behaviour (deformation and fracture; residual stresses; adhesion; experimental techniques). Materials- and process-selection. Process integration. Design of microdevice components to meet specified performance and reliability targets using realistic manufacturing processes.

Terms: Fall 2018

Instructors: Vengallatore, Srikar (Fall)

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