The McGill Nanotools - Microfab is a 150mm compatible lab. It is equipped with standard and specialized Micro and Nanofabrication equipment.
Lithography
- Contact Broadband UV (<1um): EVG620
- Electron Beam Litho (<30nm): TESCAN Mira
- UV laser maskless direct write (1um):Dilases 650
- Thermal Probe AFM Lithography (<20nm): Heidenburg-Nanofrazor Explore
Thin films
- Ebeam Evaporator (Ag,Ni,Au,Ti,Cr,Pd,Pt,Al,SiO2,SiO,...) : BJD, Nexdep
- DC and RF sputter (SiO2,SiN,ITO,Ti,Cr,Mo,Zr,Au,Au,Al,SiC...): Denton Explore, Angstrom Engineering-Amode
- Spin Coater: Laurell Technology
- Spray Coater: EVG 101
- Atomic layer deposition: VECCO Fiji G2
- Parylene coater: SCS 200
Etching
- DRIE: Oxford instrument Plasma Pro 100 Estrelas
- RIE (HBr, Cl2, CF4, CHF3, SF6, O2, Ar...): AM5000
- ICP for III, IV (Cl2, BCl 3, SiCl4, CH4, H2, Ar, SF6, CF4, O2 ): Plasma Therm APEC SLR
- XeF2 isotropic etch: Xactix E2
- HF wet bench
- Acid/Base wet bench
- KOH/TMAH wet bench
- Solvent wet bench
Packaging and Assembly:
- Wafer bonder (Anodic, Direct, Adhesive Eutectic): EVG501
- Dicing saw: Disco 3240
- WireBonder: WestBond 747677E
Characterization
- Spectroscopic Ellipsometry:Sopra GES-5E
- White light interferometer:Wylo Optical Profiler
- Optical microscopes: Ziess, Olympus
- Reflectometer: Nanospec
- Stress measurement: Flexus Stress
- Sheet resistance
- Probe station
- Stylus Profilometer: Ambois, DEKTAK-XT
- SEM: TESCAN VEGA3 XMH