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Packaging

Packaging Workshop

Wed, 2013-01-30 (All day)

L’Atelier scientifique sur les composants et microsystèmes: évolution des techniques de packaging et d’interconnexion.

The ISS Program would like to announce a special 1-day workshop on Device Packaging to be presented Wednesday January 30, 2013 in collaboration with Le laboratoire Nanotechnologies Nanosystèmes (LN2), Le Centre de Collaboration MiQro Innovation (C2MI) and NanoQuébec.

“L’Atelier scientifique sur les composants et microsystèmes: évolution des techniques de packaging et d’interconnexion” will be presented at the C2MI in Bromont, QC from 8:30

Contact Information

Contact: Rowena Franklin
Organization: McGill University
Email:
Office Phone: 514-398-8718
Category:
Source Site: /miam